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    中国(上海)国际电子封装测试展览会

    [展会时间轴]  发布时间:2021/9/14 15:02:58  浏览:31839次
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  • 今天是2024年3月19日 星期二 这里是中国(上海)国际电子封装测试展览会预告,由系统自动更新仅供参考。会展信息港提醒您:因办展存在不可控性导致展会延期无法及时获取更新,参观参展前请务必联系客服/主办方核实确认。会展信息港祝您参展愉快!
    中国(上海)国际电子封装测试展览会,上海名展,欢迎参展,圆您会展梦。参展参观在线登记,查看展会概况、展会日程、展会时间、展会地点、参展范围、主办单位、参展商等详细信息。

    当今中国已成为世界**大电子信息产品的制造国之一,众多世界著名电子公司的大量一级、二级封装正在转入我国生产,如今封装测试、烧结技能已演变成半导体、LED、电子领域一颗明珠,是集成电路芯片生产完成后不可缺少的一道工序,是器件到系统的桥梁。为本行业及上下游行业提供信息交流,市场开拓和经营决策、产品展示、技术开发的平台,为企事业单位、科研院所和高等院校搭建桥梁。为更好的推动电子封装测试业界交流互动,提升电子封装测试行业国际化水平,“中国(上海)国际电子封装测试展览会(CIEPET-)”将在上海新国际博览中心隆重召开。CIEPET- 分为展览会、高峰论坛和学术会议三大板块,是电子封装测试行业的年度盛会,也是电子封装测试行业和相关产业交流合作的综合性专业展示平台。

    参展范围
    电子金属封装、电子陶瓷封装、电子塑料封装、电子环氧树脂材料封装、封装材料与工艺、电子封装设备及先进制造技术、电子封装测试技术设备、电子烧结相关产品与技术等;
    先进封装与系统集成: 球栅阵列封装、芯片级封装、倒装芯片、晶圆级封装、三维集成及其它各种先进的封装和系统集成技术等;
    封装材料与工艺: 键和丝、焊球、焊膏、导电胶等互连材料;芯片下填料、粘结剂、薄膜材料、介电材料、基板材料、框架材料、导热材料、绿色电子材料以及其他能够高封装性能和降低成本的新型材料;以及各种各样的封装与组装工艺等;
    封装设计与模拟: 各种新的封装/组装设计;电子封装的电、热、光和机械特性建模、模拟和验证方法;多尺度和多物理量建模等;
    新兴领域封装: 传感器、执行器、微机电系统、纳机电系统、微光机电系统的封装技术;光电子封装,CMOS图像传感器封装;封装及集成技术在液晶显示,无源元件,射频、功率和高压器件,及纳米器件等新兴领域的应用等;
    高密度基板及组装技术: 嵌入式无源和有源元件基板技术;高密度互连基板、印刷线路板、高密度高性能基板;及其它能够提高基板密度和性能的各种新型基板技术等;

    China (Shanghai) International Electronic Packaging Test exhibition, Shanghai famous exhibition, welcome to participate in the exhibition, round you will show your dream. Online registration of exhibitors to view the exhibition overview, exhibition schedule, exhibition time, exhibition location, scope of participation, organizers, exhibitors and other details.

    Today, China has become one of the world's largest electronic information products manufacturers, many of the world's famous electronic companies are transferred to China's production of a large number of first- and second-level packaging, now packaging testing, sintering skills have evolved into semiconductors, LEDs, electronics field of a pearl, is an indispensable process after the completion of integrated circuit chip production, is a device-to-system bridge. For the industry and upstream and downstream industries to provide information exchange, market development and business decision-making, product display, technology development platform for enterprises and institutions, research institutes and institutions of higher learning to build bridges. In order to better promote the electronic packaging testing industry interaction, improve the international level of the electronic packaging testing industry, "China (Shanghai) International Electronic Packaging Testing Exhibition (CIEPET-) " will be held in Shanghai New International Expo Center. CIEPET - divided into exhibitions, summit forums and academic conferences, is the electronic packaging testing industry's annual event, but also the electronic packaging testing industry and related industries exchange and cooperation of a comprehensive professional display platform.

    The scope of the exhibition
    Electronic metal packaging, electronic ceramic packaging, electronic plastic packaging, electronic epoxy resin material packaging, packaging materials and processes, electronic packaging equipment and advanced manufacturing technology, electronic packaging testing technology equipment, electronic sintering-related products and technologies;
    Advanced packaging and system integration: ball grid array packaging, chip-level packaging, flip chip, wafer-level packaging, 3D integration and a variety of other advanced packaging and system integration technology;
    Package materials and processes: keys and wire, welding balls, solder paste, conductive glue and other interconnecting materials; Sub-chip fillers, binders, thin-film materials, dielectric materials, substrate materials, frame materials, thermal conductive materials, green electronic materials and other new materials that can high package performance and reduce costs; as well as a variety of packaging and assembly processes;
    Package design and simulation: a variety of new package/assembly designs, electronic packaging of electrical, thermal, optical and mechanical characteristics modeling, simulation and verification methods; Multi-scale and multiphysical modeling, etc.
    Emerging field packaging: sensors, actuators, micro-electromechanical systems, nano-mechanical systems, micro-optical electromechanical system packaging technology; Optoelectronic package, CMOS image sensor package; Packaging and integration technology in liquid crystal display, passive components, RF, power and high-voltage devices, and nano-devices and other emerging applications;
    High-density substrate and assembly technology: embedded passive and active component substrate technology; High-density interconnect substrates, printed circuit boards, high-density high-performance substrates; and other new substrate technologies that can improve the density and performance of substrates;

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    信息标签: 上海封装测试展   | 2022上海电子封装测试展会
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